LEXAN™ 牌号 PC4800 种类 PC
产品说明 PC4800 resin is a very high flow (MFR = 8.0 at 250C/1.2kg) polycarbonate product designed for use in the optical media market. It is available exclusively at www.sabicpc.com.

SABIC LEXAN™ PC PC4800 物性表

属性典型值UNITS测试手段
MECHANICAL
Tensile Stress, yld, Type I, 50 mm/min60MPaASTM D638
Tensile Strain, yld, Type I, 50 mm/min6%ASTM D638
Tensile Strain, brk, Type I, 50 mm/min>40%ASTM D638
Tensile Modulus, 50 mm/min2350MPaASTM D638
Flexural Stress, yld, 1.3 mm/min, 50 mm span90MPaASTM D790
Flexural Modulus, 1.3 mm/min, 50 mm span2300MPaASTM D790
Tensile Stress, yield, 50 mm/min60MPaISO 527
Tensile Strain, yield, 50 mm/min6%ISO 527
Tensile Strain, break, 50 mm/min>40%ISO 527
Tensile Modulus, 1 mm/min2350MPaISO 527
Flexural Stress, yield, 2 mm/min90MPaISO 178
Flexural Modulus, 2 mm/min2300MPaISO 178
IMPACT
Izod Impact, unnotched 80*10*3 +23°CNBkJ/m²ISO 180/1U
Izod Impact, unnotched 80*10*3 -30°CNBkJ/m²ISO 180/1U
Izod Impact, notched 80*10*3 +23°C15kJ/m²ISO 180/1A
Izod Impact, notched 80*10*3 -30°C12kJ/m²ISO 180/1A
THERMAL
Vicat Softening Temp, Rate B/50138°CASTM D1525
HDT, 0.45 MPa, 3.2 mm132°CASTM D648
HDT, 1.82 MPa, 3.2 mm122°CASTM D648
CTE, -40°C to 95°C, flow7.E-051/°CASTM E831
Thermal Conductivity0.2W/m-°CASTM C177
Thermal Conductivity0.2W/m-°CISO 8302
CTE, 23°C to 80°C, flow7.E-051/°CISO 11359-2
Ball Pressure Test, 125°C +/- 2°CPasses-IEC 60695-10-2
Vicat Softening Temp, Rate B/50138°CISO 306
HDT/Bf, 0.45 MPa Flatw 80*10*4 sp=64mm132°CISO 75/Bf
HDT/Af, 1.8 MPa Flatw 80*10*4 sp=64mm122°CISO 75/Af
PHYSICAL
Specific Gravity1.2-ASTM D792
Water Absorption, (23°C/Saturated)0.35%ASTM D570
Mold Shrinkage on Tensile Bar, flow0.5-0.7%SABIC method
Melt Flow Rate, 250°C/1.2 kgf8g/10 minASTM D1238
Density1.2g/cm³ISO 1183
Water Absorption, (23°C/saturated)0.35%ISO 62-1
Melt Volume Rate, MVR at 250°C/1.2 kg7cm³/10 minISO 1133
OPTICAL
Light Transmission, 2.54 mm>90%ASTM D1003
Haze, 2.54 mm<0.7%ASTM D1003
Refractive Index1.586-ASTM D542
Refractive Index1.586-ISO 489
ELECTRICAL
Volume Resistivity>1.E+15Ω.cmIEC 60093
Relative Permittivity, 1 MHz3-IEC 60250
Dissipation Factor, 1 MHz0.01-IEC 60250
Injection Molding
Drying Temperature120°C
Drying Time4-6Hrs
Maximum Moisture Content0.02%
Melt Temperature340-370°C
Nozzle Temperature340-370°C
Front - Zone 3 Temperature350-380°C
Middle - Zone 2 Temperature320-340°C
Rear - Zone 1 Temperature270-290°C
Hopper Temperature60-80°C
Mold Temperature75-95°C
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